Code of Federal Regulations Title 29. Labor § 29.1910.1024—Operations for Establishing Beryllium Work Areas

Table A.1—Operations for Establishing Beryllium Work Areas Where Processing Materials Containing at Least 0.1 Percent Beryllium by Weight

Abrasive Blasting.

Abrasive Blasting.

Abrasive Blasting.

Abrasive Processing.

Abrasive Processing.

Abrasive Processing.

Abrasive Sawing.

Abrasive Sawing.

Abrasive Sawing.

Annealing.

Annealing.

Boring.

Bright Cleaning.

Atomizing.

Brazing (>1,100 °C).

Brushing.

Attritioning.

Broaching with green ceramic.

Buffing.

Blanking.

Brushing.

Burnishing.

Bonding.

Buffing.

Casting.

Boring.

Centerless grinding.

Centerless Grinding.

Breaking.

Chemical Cleaning.

Chemical Cleaning.

Bright Cleaning.

Chemical Etching.

Chemical Etching.

Broaching.

CNC Machining.

Chemical Milling.

Brushing.

Cold Isostatic Pressing (CIP).

Dross Handling.

Buffing.

Crushing.

Deburring (grinding).

Burnishing.

Cutting.

Electrical Chemical Machining (ECM).

Casting.

Deburring (grinding).

Electrical Discharge Machining (EDM).

Centerless Grinding.

Deburring (non-grinding).

Extrusion.

Chemical Cleaning.

Destructive Testing.

Forging.

Chemical Etching

Dicing.

Grinding.

Chemical Milling.

Drilling.

Heat Treating (in air).

CNC Machining

Dry/wet Tumbling.

High Speed Machining (>10,000 rpm).

Cold Isostatic Pressing.

Extrusion.

Hot Rolling.

Cold Pilger.

Filing by Hand.

Lapping.

Crushing.

Firing of Green Ceramic.

Laser Cutting.

Cutting.

Firing of Refractory Metallization (>1,100 °C).

Laser Machining.

Deburring.

Grinding.

Laser Scribing.

Dicing.

Honing.

Laser Marking.

Drawing.

Hot Isostatic Pressing (HIP).

Melting.

Drilling.

Lapping.

Photo-Etching.

Dross Handling.

Laser Cutting.

Pickling.

Electrical Chemical Machining (ECM).

Laser Machining.

Point and Chamfer.

Electrical Discharge Machining (EDM).

Laser Scribing.

Polishing.

Extrusion.

Laser Marking.

Torch Cutting (i.e., oxy-acetylene).

Filing by Hand.

Machining.

Tumbling.

Forging.

Milling.

Water-jet Cutting.

Grinding.

Piercing.

Welding.

Heading.

Mixing.

Sanding.

Heat Treating.

Plasma Spray.

Slab Milling.

Honing.

Polishing.

Hot Isostatic Pressing (HIP).

Powder Handling.

Lapping.

Powder Pressing.

Laser Cutting.

Reaming.

Laser Machining.

Sanding.

Laser Scribing.

Sectioning.

Laser Marking.

Shearing.

Machining.

Sintering of Green Ceramic.

Melting.

Sintering of Refractory Metallization (>1,100 °C).

Milling.

Snapping.

Mixing.

Spray Drying.

Photo-Etching.

Tape Casting.

Pickling.

Turning.

Piercing.

Water Jet Cutting.

Pilger.

Plasma Spray.

Point and Chamfer.

Polishing.

Powder Handling.

Powder Pressing.

Pressing.

Reaming.

Roll Bonding.

Rolling.

Sanding.

Sawing (tooth blade).

Shearing.

Sizing.

Skiving.

Slitting.

Snapping.

Sputtering.

Stamping.

Spray Drying.

Tapping.

Tensile Testing.

Torch Cutting (i.e., oxy acetylene).

Trepanning.

Tumbling

Turning.

Vapor Deposition.

Water-Jet Cutting.

Welding.